根据供应商风险等级划分，来确定芯片验收流程，并根据以下标准进行产品入库
Determine the chip acceptance process based on the supplier risk level classification, and conduct product warehousing according to the following standards.

1、供应商建档

2、外包装包装和文件检查

3、产品标签检测：与标签数据库进行比对

4、芯片外观检查：检查任何不一致和缺陷的产品，表面翻新、假冒或可靠性不佳的产品。

5、丝印和表面翻新测试：与丝印标签库比对，并采用化学溶剂法和机械刮擦法进行显示。

6、尺寸测量：通过测量产品尺寸并与制造商的规格进行比较来验证封装尺寸。

7、X-ray检查：验证样品的内部结构是否相同，或样品与数据库是否相同。

8、电气性能试验：确认静态参数在制造商的规格范围内。

9、可焊性测试：采用浸入观察法确认器件引脚和端子的可焊性。

10、开盖：器件开封后通过观察晶圆表面的印字或通过与数据库和金样对比，确定产品是否为正品。

11、数码摄影建档：记录整个产品测试过程，并上传至我们的质控数据库。

12、安全入库：通过质量检验的产品将安全转移至我们的仓库。

1. Supplier filing

2. External packaging and document inspection

3. Product label detection: Comparison with label database

4. Chip appearance inspection: Check for any inconsistent or defective products, products with refurbished surfaces, counterfeits, or poor reliability.

5. Screen printing and surface refurbishment testing: Compare with the screen printing label library and display using chemical solvent method and 

mechanical scraping method.

6. Size measurement: Verify packaging dimensions by measuring product dimensions and comparing them with the manufacturer's specifications.

7. X-ray inspection: Verify whether the internal structure of the sample is the same, or whether the sample is the same as the database.

8. Electrical performance test: Confirm that the static parameters are within the manufacturer's specification range.

9. Solderability test: Use immersion observation method to confirm the solderability of device pins and terminals.

10. Opening the cover: After the device is opened, it is determined whether the product is genuine by observing the printing on the surface 

of the wafer or comparing it with the database and gold sample.

11. Digital Photography Archive: Record the entire product testing process and upload it to our quality control database.

12. Safe storage: Products that have passed quality inspection will be safely transferred to our warehouse.